BERGQUIST® SIL PAD TSP 3500 is a thermally-conductive, insulating, rigid, pre-cured pad used between heat sink or metal housing and components. It is formulated to maximize both the thermal and dielectric performance of the filler/binder matrix. The conformable material is grease free and reinforced with fiberglass, providing high reliability for electronic packaging applications.
Typical applications include power supplies, motor controls, power semiconductors, aerospace, and avionics. For information on UL certifications for our Thermal Management Materials Portfolio,please refer to UL file No. E59150.
· Thermal impedance: 0.33°C (32.6°F) -in2/W at 50 psi
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US 16496 
GB 12368 
CA 9837 
AU 7655 
IE 2376 
IN 1338 
BR 1267 
NZ 1129 
