Features :
 

• Sturdy Metal and Aluminum Structure: Specifically designed for solder paste and red glue printing, providing durability and stability for consistent performance.
• Manual Operation: Allows manual positioning, board placement, printing, and board removal, making it ideal for precise, hands-on control.
• Flexible Location Modes: Features both side and hole-based location options, with four-sided micrometric adjustments to ensure accurate alignment between the stencil and PCB.
• Adjustable Settings: Fully customizable, allowing for manual adjustments to meet a variety of printing requirements.
• Adaptable for PCB Thicknesses: Accommodates PCB thicknesses up to 100mm, making it versatile for different positioning modules and board thicknesses.

---

Specifications :
 

Printing Area	Large 450 x 600mm
	Medium 310 x 410mm
	Small 240 x 300mm
Location Mode	By side
Setting Mode	Manual micromatic setting
Setting Direction	Forward and backward, left and right, up and down
Printing Precision	0.5mm pitch QTP

---